Mimix Broadband offers various options for shipment of our semiconductors, whether bare die devices, packaged parts or evaluation modules.

We offer the following options for bare die products: (1) Grip Ring for complete wafers; (2) Waffle Tray for die; and (3) Vacuum Release “Gel” Pack for die. (Note: Due to the size of some devices (i.e. single FET devices) Waffle Trays may not be an option.) The Mimix preferred package is Gel Pack, which provides the greatest protection from shipping damage.

Mimix Broadband also offers a wide range of packaged products. These products are typically offered in bulk or tape and reel configurations.

Evaluation modules are also available for most of our products.

Please refer to each datasheet for complete, detailed part number ordering information. When placing orders, please use the complete part number for accurate packaging and shipment.

Purchase Order Submissions

OrderEntry@mimixbroadband.com

Product & Technical Support

Field Application Engineers
Tel: 281.988.4600
Fax: 281.988.4615
technicalhelp@mimixbroadband.com