Mimix Broadband, Inc. Introduces 13/15 GHz 3-Chip Transceiver Solution for Wireless Communications Applications

Complete Transceiver Solution Consists of Receiver, Transmitter and Power Amplifier

October 12, 2005, Houston, Texas – Mimix Broadband, Inc. announced today the introduction of a Gallium Arsenide (GaAs) monolithic microwave integrated circuit (MMIC) 13/15 GHz chip set that consists of a highly integrated image reject receiver and transmitter, and compact, two stage power amplifier. The image reject mixers eliminate the need for an image bandpass filter after the amplifier to remove thermal noise at the image frequency. Using 0.15 micron gate length GaAs pseudomorphic high electron mobility transistor (pHEMT) device model technology, these devices achieve the following performance levels:

This “Mimix 3-Chip Solution” lowers costs and variability of transceivers by using fewer parts, a smaller footprint area and a simpler design. These devices are well suited for wireless communications applications such as millimeter-wave point-to-point radio, local multipoint distribution services (LMDS), SATCOM and VSAT applications.

“The receiver uses an image reject resistive ‘cold fet’ fundamental mixer to provide wide bandwidth and excellent intermodulation performance,” stated Dr. Jim Harvey, CTO of Mimix Broadband, Inc. “An image reject balanced mixer is used in the transmitter, or up-converter, to minimize spurious and ease filtering requirements before the up-converted signal is fed to the compact single ended PA. Linearity is suitable for the high order QAM modulation required in new radios to maximize spectrum usage. The useful bandwidth of the receiver and transmitter is 10 to 18 GHz, flat from 11 to 17 GHz, so they cover the commercial 13 and 15 GHz bands and intermediate satellite bands.”

Mimix performs 100% on-wafer RF and DC testing on these products, as well as 100% visual inspection to MIL-STD-883 method 2010. The chips also have surface passivation to protect and provide rugged parts with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process.

Engineering samples are available today from stock. Technical support is also available from Mimix’s applications engineers at 281.988.4600. The datasheets and additional product information can be obtained from the Mimix Broadband website at www.mimixbroadband.com.

About Mimix
Mimix Broadband, Inc., an ISO 9001-registered company, designs, develops and supplies high performance monolithic microwave integrated circuits (MMICs) for microwave and millimeter-wave wireless communications applications. Mimix has assembled a team of world-class scientists that has focused on the development of state-of-the-art millimeter-wave MMICs for the last decade. The Company also leverages strategic partnerships for manufacturing, in order to expedite the time-to-market cycle and meet market requirements. Due in part to its recent acquisition of Celeritek, Mimix offers a highly diversified product line that serves the top tier telecom, satellite and defense companies, and Mimix combines its design capabilities in complete communications systems with semiconductor device expertise to deliver innovative solutions for its customers’ most challenging applications.