Mimix Broadband, Inc. Introduces 21.2 to 23.6 GHz GaAs MMIC Receiver with 2.5 dB Noise Figure for Entire Receive Chain

Highly Integrated Receiver Includes Low Noise Amplifier, LO Buffer and Image Reject Mixer

September 27, 2004, Houston, Texas - Mimix Broadband, Inc. introduces today a Gallium Arsenide (GaAs) monolithic microwave integrated circuit (MMIC) sub-harmonically pumped receiver that integrates a two stage balanced LNA followed by an image reject sub-harmonic anti-parallel diode mixer and includes an integrated LO buffer amplifier. The image reject mixer eliminates the need for an image bandpass filter after the output amplifier to remove thermal noise at the image frequency. Using 0.15 micron gate length GaAs pseudomorphic high electron mobility transistor (pHEMT) device model technology, this receiver covers the 21.2 to 23.6 GHz frequency bands. The MMIC device has 2.5 dB noise figure, 20 dB image rejection across the band, and 2 dBm LO drive level.

This receiver, identified as 22REC0393, is well suited for wireless communications applications such as millimeter-wave point-to-point radio, local multipoint distribution services (LMDS), and SATCOM.

"The device is suited to LSB or USB operation with receive intermediate frequencies in the range DC up to 2.5 GHz, and has a total response from 17 GHz to 27 GHz on the appropriate sideband," stated Dr. Jim Harvey, CTO of Mimix Broadband, Inc. "The use of anti-parallel diodes and incorporation of an LO buffer reduce the number of MMICs needed to construct a 23 GHz commercial radio, and the circuits have application in multipoint radios in the bands up to 27 GHz. With input referred 1dB compression point greater than -14 dBm, this receiver has margin for the demanding ETSI requirements for PDH radios."

Mimix performs 100% on-wafer RF, DC and noise figure testing on the 22REC0393, as well as 100% visual inspection to MIL-STD-883 method 2010. The chip also has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process.

Engineering samples are available today from stock, and production quantities are available 6-8 weeks ARO. Technical support is also available from Mimix's applications engineers at 281.988.4600. The 22REC0393 datasheet and additional product information can be obtained from the Mimix Broadband website at www.mimixbroadband.com.

About Mimix
Mimix Broadband, Inc., an ISO 9001-registered company, designs, develops and supplies high performance monolithic microwave integrated circuits (MMICs) for microwave and millimeter-wave wireless communications applications. Mimix has assembled a team of world-class scientists that has focused on the development of state-of-the-art millimeter-wave MMICs for the last decade. The Company also leverages strategic partnerships for manufacturing, in order to expedite the time-to-market cycle and meet market requirements. Mimix combines its design capabilities in complete communications systems with semiconductor device expertise to deliver innovative solutions for its customers' most challenging applications.