Mimix Broadband, Inc. Introduces 21.2 to 23.6 GHz GaAs MMIC Up-Converter with +20 dBm Output Third Order Intercept Point

Highly Integrated Up-Converter Includes Image Reject Mixer, LO Buffer and Output Amplifier

September 27, 2004, Houston, Texas - Mimix Broadband, Inc. introduces today a Gallium Arsenide (GaAs) monolithic microwave integrated circuit (MMIC) sub-harmonically pumped up-converter, which integrates an image reject sub-harmonic anti-parallel diode mixer followed by a balanced two stage output amplifier and includes an integrated LO buffer amplifier. The image reject mixer eliminates the need for an image bandpass filter after the output amplifier to remove signal power at the image frequency. Using 0.15 micron gate length GaAs pseudomorphic high electron mobility transistor (pHEMT) device model technology, this up-converter covers the 21.2 to 23.6 GHz frequency bands. The MMIC device has +20 dBm output third order intercept (OIP3), 15 dB image rejection across the band, and 2 dBm LO drive level.

This up-converter, identified as 22TX0392, is well suited for wireless communications applications such as millimeter-wave point-to-point radio, local multipoint distribution services (LMDS), and SATCOM.

"The device is suited to LSB or USB operation with transmit intermediate frequencies in the range DC up to 2.5 GHz, and has a total response from 17 GHz to 27 GHz on the appropriate sideband," stated Dr. Jim Harvey, CTO of Mimix Broadband, Inc. "The use of anti-parallel diodes and incorporation of an LO buffer reduce the number of MMICs needed to construct a 23 GHz commercial radio, as the output power level is high enough that only a single PA is needed to deliver the required power to the radio output. The circuits also have application in multipoint radios in the bands up to 27 GHz."

Mimix performs 100% on-wafer RF and DC testing on the 22TX0392, as well as 100% visual inspection to MIL-STD-883 method 2010. The chip also has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process.

Engineering samples are available today from stock, and production quantities are available 6-8 weeks ARO. Technical support is alsoorder to expedite the time-to-market cycle and meet market requirements. Mimix combines its design capabilities in complete communications systems with semiconductor device expertise to deliver innovative solutions for its customers' most challenging applications.