Facilty Overview

Headquarters - Mimix Broadband operates an ISO 9001-registered manufacturing, assembly, test and management facility at its Houston, Texas headquarters. The 33,500 square feet facility includes a Class 10,000 Clean Room used for wafer probe testing of MMICs, die picking and die inspection. Our test capability covers from DC to 50 GHz and includes automated testing and handling of MMIC, module and sub-assembly products. Electrical and mechanical design of evaluation modules, reference designs and module products is performed at the Houston facility. Corporate Sales, Marketing and Applications Engineering are also located on-site. We partner with Manufacturer’s Sales Representative and Distribution firms worldwide to effectively service customers.

Design Centers - Mimix has two ISO 9001-registered GaAs semiconductor design centers: a 3,000 square feet facility for high frequency MMICs located in North Sydney, Australia and a 3,500 square feet facility for low frequency GaAs semiconductors in Belfast, Northern Ireland. Our design centers consist of networked computers running commercial and proprietary design software and include state-of-the-art wafer probe laboratories with load pull capability, prototype testing and device characterization up to 50 GHz. The facilities have bonding equipment for low-volume, prototype production capability for packaging products and manufacturing sub-assemblies. Our GaAs semiconductor design experience includes pHEMT, MESFET, HBT and HFET IC fabrication processes in the microwave and millimeter-wave range. We combine this semiconductor expertise with our experience in total system design to provide comprehensive insight into the technology and issues that customers confront in designing their products.

Our Applications Design Center in Houston offers unsurpassed applications support. Evaluation modules are available to expedite testing, and many products are offered in surface mount technology (SMT) packages, designed to be assembled using standard SMT manufacturing processes. Reference designs and extensive applications engineering support reduces time-to-market for our customers.

Manufacturing and Test - Mimix’s 33,500 square feet production facility in Houston performs order management, assembly and test/inspection functions. We also employ the services of leading GaAs foundries for semiconductor wafer processing. High volume IC assembly and environmental screening is performed at qualified subcontractors. The production flow is seamlessly managed from design through final test. This business model allows the company to focus on its strengths in MMIC design, products, applications, and test, while leveraging the most appropriate processing capability from its various foundry, assembly, and screening sources.

Clean Room Assembly and Test - Our Class 10,000 clean rooms are used for MMIC wafer and die handling/inspection. We have the capability to assemble MMICs into complex sub-assemblies, and can process and supply MMIC die in carriers to commercial and military level specifications. Our state-of-the-art DC to 50 GHz wafer probe facility with environmental capability is used for design validation, tests specific to customer application and production testing. Other test labs contain equipment for automated RF testing of sub-assemblies.

Mimix Asia - Our Taiwan facility includes a Class 10,000 clean room for die picking and visual inspection that gives Mimix access to 8,000 square feet of production floor space in Hsinchu Science-based Industrial Park, which is in close proximity to some of Mimix’s wafer fabrication and other production partners. This strategic location reduces production cycle time and expedites delivery to Mimix customers.

IC Package Assembly - Mimix has built manufacturing- and quality-qualified partnerships for the design, high volume assembly and testing of SMT packaged MMICs. Our packaged MMICs are 100% visual inspected at die, at assembly prior to encapsulation, and at shipment of the packaged ICs. Assembly, test, and inspection data is archived for traceability. The packaged parts are 100% RF, microwave, or millimeter-wave tested.